Solder Paste Product Information for
Pb No Clean Solder Paste, 500g
Made with high-purity raw materials and extensively tested.
A special formulation of highest purity ingredients to ensure the process consistency of today's demanding ultra-fine-pitch challenges. We not only offer a full line of water-soluble fluxes and paste for SMT and IC packaging applications, we provide halide or halide-free fluxes for tin/lead s well as lead-free solder alloys. Our formulations offer wide processing windows and offer excellent shelf life, with full wetting and clean-ability features to prolong stencil life.
REFLOW PROFILE
SPECIFICATIONS:
HANDLING & STORAGE INSTRUCTIONS:
- 1. Ramp @ 1~3°C/sec to 120~170°C
- 2. Dwell @ 120~170°C for 60~120 sec
- 3. Ramp @ 1~3°C/sec to 210~230°C peak temperature
Temp. over 200°C for 30~60 sec - 4. Ramp down to room temperature @ 1~3°C/sec
SPECIFICATIONS:
- Alloy: SN63/PB37
- Melting point: 183°C
- Particle size: Type 3 per J-STD-006
- Powder shape: sphere
- Flux content: 9.5 ±0.5wt%
- Halide content: 200 - 500ppm
- Viscosity: 200 ± 30 Pa.s (25 ± 1°C)
- Flux type: Resin flux ROL0 per J-STD-004
- P/N SH-6309RMA
HANDLING & STORAGE INSTRUCTIONS:
- Store at 0 - 10°C.
- Shelf life: 6 months from production date (sealed jar).
- Keep out of direct sunlight.
PDF FILE LINKS
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P/N SH-6309RMAPb - SN63No Clean Solder Paste |
- Allow solder paste to reach room temperature of 23°C - 27ºC for 3 to 4 hours prior to use. Do not heat to raise temperature!
- Mix with plastic spatula or plastic putty knife for about 1 to 3 minutes before use.
- At first, add 1/3 jar of solder paste onto the stencil, do not add more than 1 jar.
- Add more solder paste a little at a time according to production procedure.
- To maintain the solder paste quality, make sure not to store fresh paste and used paste in the same sealed jar.
- Place all components to be mounted on printed circuit board between 4~6 hours.
- If printing is interrupted for more than one 1 hour, remove solder paste from stencil and return to jar.
- After continuously printing for 24 hours, remove solder paste from stencil.
- It is recommended to clean both sides of stencil every 4 hours manually to ensure printing quality.
- Paste can be stored for up to 30 days at room temperature (22~28°C). Recommended humidity is between 30~60%
- To clean up printed board and stencil, use isopropyl alcohol or IPA.
- Dispose of discarded paste in accordance with local and federal requirements.
- Reflow solder in accordance with appropriate datasheet
- Clean flux residue by normal industrial practice as soon as possible after reflow, not to exceed 24 hours
