Solder Paste Product Information for
LEAD-FREE WATER SOLUBLE SOLDER PASTE, 500g
Made with high-purity raw materials and extensively tested.
This lead-free water soluble paste, offering extended shelf and stencil life, is specifically designed for the precise printing requirements of µCSPs, µBGAs, 0201 and provides exceptionally low voiding characteristics on fine-pitch components as well. With excellent solderability and wetting characteristics, it is operable in air or nitrogen reflow environments and offers stable tack life on a wide variety of metallization, including OSP, Ni/Au, Ni/Pd/Au, Sn and Ag. Print-to-pause performance is excellent.
REFLOW PROFILE
SPECIFICATIONS:
HANDLING & STORAGE INSTRUCTIONS:
- A: ramp up rate during preheat: 1.0~3.0°C/sec
- B~C: soaking temperature: 155~185°C
- D: ramp up rate during reflow: 1.2~2.3°C/sec
- E: ramp down rate during cooling: 1.0~6.0°C/sec
- F~G: peak temperature: 230~250°C
- T1: preheat time: 50~80 sec
- T2: dwell time during soaking: 60~120 sec
- T3: time above 220°C: 30~100 sec
SPECIFICATIONS:
- Appearance: Gray paste
- Alloy: Sn/Ag3.0/Cu0.5/Ni0.06/Ge0.01
- Melting point: 217-219°C
- Particle size (um):
- Type 3: +45 1% large , -20 10% less
- Type 4: +38 1% large , -20 10% less
- Powder Shape: Sphere
- Flux Content: 11± 0.5wt%
- Halide content: 0.05 ± 0.02wt% (in flux)
- Viscosity (Pa.s): 200 ± 30 (25 ± 1°C, 10rmp, Malcom)
- Flux Type: OHR0
- P/N PF610-PW
HANDLING & STORAGE INSTRUCTIONS:
- Store at 0 - 10°C.
- Shelf life: 6 months from production date (sealed jar).
- Keep out of direct sunlight.
PDF FILE LINKS
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P/N PF610-PWLead-Free - SAC305Water Soluble Solder Paste |
- Allow solder paste to reach room temperature of 23°C - 27ºC for 3 to 4 hours prior to use. Do not heat to raise temperature!
- Mix with plastic spatula or plastic putty knife for about 1 to 3 minutes before use.
- At first, add 1/3 jar of solder paste onto the stencil, do not add more than 1 jar.
- Add more solder paste a little at a time according to production procedure.
- To maintain the solder paste quality, make sure not to store fresh paste and used paste in the same sealed jar.
- Place all components to be mounted on printed circuit board between 4~6 hours.
- If printing is interrupted for more than one 1 hour, remove solder paste from stencil and return to jar.
- After continuously printing for 24 hours, remove solder paste from stencil.
- It is recommended to clean both sides of stencil every 4 hours manually to ensure printing quality.
- Paste can be stored for up to 30 days at room temperature (22~28°C). Recommended humidity is between 30~60%
- To clean up printed board and stencil, use isopropyl alcohol or IPA.
- Dispose of discarded paste in accordance with local and federal requirements.
- Reflow solder in accordance with appropriate datasheet
- Clean flux residue by normal industrial practice as soon as possible after reflow, not to exceed 24 hours
