Solder Paste Product Information for
Lead-Free No Clean Solder Paste, 500g
Made with high-purity raw materials and extensively tested.
The rigors of higher processing temperatures required for lead-free soldering make unprecedented demands on paste. In addition to consistent printing and reflow requirements, there is a need for higher repeatability in high mix, high-yield lines. All these and other Pb-free challenges are met with consistency in Mann/Shenmao lead-free pastes. Processable by air or nitrogen reflow, they offer the advantages of excellent wetting characteristics and long shelf life. As the lead-free age gains global momentum, it's reassuring to know you’re going with a leader in this solder technology. That's Manncorp!
REFLOW PROFILE
SPECIFICATIONS:
HANDLING & STORAGE INSTRUCTIONS:
- ramp up rate(30~150°C): 1.0~2.0°C/sec
- preheat time(155~185°C): 30~120 sec
- time above 220°C: 30~100 sec
- ramp up rate during reflow: 1.0~2.0°C/sec
- peak temperature: 230~250°C
- ramp down rate during cooling: 1.0~6.0°C/sec
SPECIFICATIONS:
- Alloy: Sn96.5/ Ag3.0 / Cu0.5
- Melting point: 217~219°C
- Particle size: +45µm 1% large, 20µm 10% less per IPC-TM-650, 2.2.14
- Powder shape: sphere
- Flux content: 11 ± 0.5wt%
- Halide content: 0.05 ± 0.02wt% (in flux )
- Viscosity: 200 ± 30 Pa.s (25±1°C)
- Flux type: Resin flux
- P/N PF-606P
HANDLING & STORAGE INSTRUCTIONS:
- Store at 0 - 10°C.
- Shelf life: 6 months from production date (sealed jar).
- Keep out of direct sunlight.
PDF FILE LINKS
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P/N PF-606PSAC305 - Lead-FreeNo Clean Solder Paste |
- Allow solder paste to reach room temperature of 23°C - 27ºC for 3 to 4 hours prior to use. Do not heat to raise temperature!
- Mix with plastic spatula or plastic putty knife for about 1 to 3 minutes before use.
- At first, add 1/3 jar of solder paste onto the stencil, do not add more than 1 jar.
- Add more solder paste a little at a time according to production procedure.
- To maintain the solder paste quality, make sure not to store fresh paste and used paste in the same sealed jar.
- Place all components to be mounted on printed circuit board between 4~6 hours.
- If printing is interrupted for more than one 1 hour, remove solder paste from stencil and return to jar.
- After continuously printing for 24 hours, remove solder paste from stencil.
- It is recommended to clean both sides of stencil every 4 hours manually to ensure printing quality.
- Paste can be stored for up to 30 days at room temperature (22~28°C). Recommended humidity is between 30~60%
- To clean up printed board and stencil, use isopropyl alcohol or IPA.
- Dispose of discarded paste in accordance with local and federal requirements.
- Reflow solder in accordance with appropriate datasheet
- Clean flux residue by normal industrial practice as soon as possible after reflow, not to exceed 24 hours
